1.2 A RF Power Bipolar Junction Transistors (BJT) 23

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum VCEsat Minimum Power Gain (Gp) Terminal Form Package Shape No. of Elements Highest Frequency Band No. of Terminals Package Style (Meter) Sub-Category Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

MAX2602E/W

Analog Devices

NPN

SINGLE WITH BUILT-IN DIODE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

150 Cel

SILICON

15 V

DUAL

R-PDSO-G8

Not Qualified

MAX2601ESA+T

Analog Devices

NPN

SINGLE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

10

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G10

1

Not Qualified

e3

30

260

MAX2601ESA+

Analog Devices

NPN

SINGLE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

Not Qualified

e3

30

260

MAX2602ESA+T

Analog Devices

NPN

SINGLE WITH BUILT-IN DIODE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

Not Qualified

e3

30

260

MAX2602ESA+

Analog Devices

NPN

SINGLE WITH BUILT-IN DIODE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

Not Qualified

e3

30

260

AM1517-012

STMicroelectronics

NPN

SINGLE

YES

27 W

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8.5 dB

FLAT

RECTANGULAR

1

L BAND

2

FLANGE MOUNT

Other Transistors

15

200 Cel

SILICON

DUAL

R-CDFM-F2

BASE

Not Qualified

AM82223-010

STMicroelectronics

NPN

SINGLE

YES

28 W

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

6.5 dB

FLAT

RECTANGULAR

1

S BAND

2

FLANGE MOUNT

Other Transistors

20

200 Cel

SILICON

DUAL

R-CDFM-F2

BASE

Not Qualified

MSC82307

STMicroelectronics

NPN

SINGLE

NO

21.4 W

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

S BAND

2

FLANGE MOUNT

Other Transistors

30

200 Cel

8.5 pF

SILICON

RADIAL

O-CRFM-F2

BASE

Not Qualified

BLV904

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

11 dB

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

14 W

30

200 Cel

SILICON

28 V

DUAL

R-CDSO-G8

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLV904TRAY

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

11 dB

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

14 W

30

200 Cel

SILICON

28 V

DUAL

R-CDSO-G8

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLT93/SL

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

5.5 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

DISK BUTTON

25

200 Cel

SILICON

10 V

RADIAL

O-CRDB-F4

Not Qualified

HIGH RELIABILITY

BLU97

NXP Semiconductors

NPN

SINGLE

NO

4000 MHz

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8.5 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

17 W

25

200 Cel

SILICON

16 V

RADIAL

O-CRPM-F4

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLV2042

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8 dB

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

12 W

30

200 Cel

SILICON

28 V

DUAL

R-CDSO-G8

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLT92/SL

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

7 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

DISK BUTTON

25

200 Cel

SILICON

10 V

RADIAL

O-CRDB-F4

Not Qualified

HIGH RELIABILITY

BLV2042-T

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8 dB

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

12 W

30

200 Cel

SILICON

28 V

DUAL

R-CDSO-G8

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLV2042T/R

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8 dB

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

12 W

30

200 Cel

SILICON

28 V

DUAL

R-CDSO-G8

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLV904-T

NXP Semiconductors

NPN

SINGLE

YES

1.2 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

11 dB

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

14 W

30

200 Cel

SILICON

28 V

DUAL

R-CDSO-G8

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

MAX2601ESA

Maxim Integrated

NPN

SINGLE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

TIN LEAD

DUAL

R-PDSO-G8

1

Not Qualified

e0

MAX2602ESA-T

Maxim Integrated

NPN

SINGLE WITH BUILT-IN DIODE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

TIN LEAD

DUAL

R-PDSO-G8

1

Not Qualified

e0

MAX2601ESA-T

Maxim Integrated

NPN

SINGLE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

TIN LEAD

DUAL

R-PDSO-G8

1

Not Qualified

e0

MAX2602ESA

Maxim Integrated

NPN

SINGLE WITH BUILT-IN DIODE

YES

1.2 A

PLASTIC/EPOXY

AMPLIFIER

GULL WING

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

8

SMALL OUTLINE

Other Transistors

100

150 Cel

SILICON

15 V

TIN LEAD

DUAL

R-PDSO-G8

1

Not Qualified

e0

MAX2602E/D

Maxim Integrated

NPN

SINGLE WITH BUILT-IN DIODE

YES

1.2 A

UNSPECIFIED

AMPLIFIER

NO LEAD

UNSPECIFIED

1

ULTRA HIGH FREQUENCY BAND

UNCASED CHIP

150 Cel

SILICON

15 V

TIN LEAD

UPPER

X-XUUC-N

3

Not Qualified

e0

2SC892

Renesas Electronics

NPN

SINGLE

NO

18 W

1.2 A

1

Other Transistors

175 Cel

RF Power Bipolar Junction Transistors (BJT)

RF Power Bipolar Junction Transistors (BJT) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.

RF Power BJTs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.

The RF Power BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

RF Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.

Proper selection and use of RF Power BJTs are critical to ensure optimal performance, reliability, and compatibility with other components in the circuit. RF Power BJTs are often used in conjunction with other components, such as filters and matching networks, to form complete RF power amplification circuits.