250 W RF Power Bipolar Junction Transistors (BJT) 12

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum VCEsat Minimum Power Gain (Gp) Terminal Form Package Shape No. of Elements Highest Frequency Band No. of Terminals Package Style (Meter) Sub-Category Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

2SC2879A

Toshiba

NPN

SINGLE

YES

250 W

25 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

HIGH FREQUENCY BAND

4

FLANGE MOUNT

Other Transistors

10

175 Cel

SILICON

18 V

RADIAL

O-CRFM-F4

Not Qualified

1090MP

Microsemi

NPN

SINGLE

YES

250 W

6.5 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

L BAND

4

DISK BUTTON

Other Transistors

15

200 Cel

16 pF

SILICON

TIN LEAD

RADIAL

O-CRDB-F4

Not Qualified

e0

1075MP

Microsemi

NPN

SINGLE

YES

250 W

6.5 A

UNSPECIFIED

AMPLIFIER

FLAT

ROUND

1

L BAND

4

DISK BUTTON

BIP RF Small Signal

20

200 Cel

50 pF

SILICON

65 V

TIN LEAD

RADIAL

O-XRDB-F4

Not Qualified

e0

2SC2879

Toshiba

NPN

SINGLE

YES

100 MHz

250 W

25 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

13 dB

FLAT

ROUND

1

HIGH FREQUENCY BAND

4

FLANGE MOUNT

Other Transistors

250 W

10

175 Cel

SILICON

18 V

RADIAL

O-CRFM-F4

Not Qualified

2SC2510

Toshiba

NPN

SINGLE

NO

250 W

20 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

12.2 dB

FLAT

ROUND

1

HIGH FREQUENCY BAND

4

FLANGE MOUNT

Other Transistors

250 W

10

175 Cel

600 pF

SILICON

35 V

RADIAL

O-CRFM-F4

Not Qualified

2SC2510A

Toshiba

NPN

SINGLE

YES

250 W

20 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

HIGH FREQUENCY BAND

4

FLANGE MOUNT

Other Transistors

10

175 Cel

600 pF

SILICON

35 V

RADIAL

O-CRFM-F4

Not Qualified

MRF492A

Motorola

NPN

SINGLE

NO

50 MHz

250 W

20 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

11 dB

FLAT

ROUND

1

VERY HIGH FREQUENCY BAND

4

POST/STUD MOUNT

Other Transistors

10

150 Cel

450 pF

SILICON

18 V

TIN LEAD

RADIAL

O-CRPM-F4

Not Qualified

e0

BLV958

NXP Semiconductors

NPN

SINGLE

YES

250 W

15 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8.5 dB

FLAT

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

2

FLANGE MOUNT

Other Transistors

145 W

30

200 Cel

SILICON

30 V

DUAL

R-CDFM-F2

EMITTER

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLV2347

NXP Semiconductors

NPN

SINGLE

YES

250 W

10 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

2

FLANGE MOUNT

Other Transistors

45

200 Cel

SILICON

27 V

DUAL

R-CDFM-F2

EMITTER

Not Qualified

HIGH RELIABILITY

BLV958FL

NXP Semiconductors

NPN

SINGLE

YES

250 W

15 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

8.5 dB

FLAT

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

2

FLATPACK

Other Transistors

145 W

30

200 Cel

SILICON

30 V

DUAL

R-CDFP-F2

EMITTER

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

MRF20060RS

NXP Semiconductors

NPN

SINGLE

YES

250 W

8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

RECTANGULAR

1

L BAND

2

FLATPACK

Other Transistors

20

200 Cel

SILICON

25 V

Tin/Lead (Sn/Pb)

DUAL

R-CDFP-F2

EMITTER

Not Qualified

e0

MRF20060R

NXP Semiconductors

NPN

SINGLE

YES

250 W

8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

RECTANGULAR

1

L BAND

2

FLANGE MOUNT

Other Transistors

20

200 Cel

SILICON

25 V

Tin/Lead (Sn/Pb)

DUAL

R-CDFM-F2

EMITTER

Not Qualified

e0

RF Power Bipolar Junction Transistors (BJT)

RF Power Bipolar Junction Transistors (BJT) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.

RF Power BJTs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.

The RF Power BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

RF Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.

Proper selection and use of RF Power BJTs are critical to ensure optimal performance, reliability, and compatibility with other components in the circuit. RF Power BJTs are often used in conjunction with other components, such as filters and matching networks, to form complete RF power amplification circuits.