.3 W Small Signal Bipolar Junction Transistors (BJT) 1,520

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Minimum DS Breakdown Voltage Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Turn Off Time (toff) Terminal Finish Maximum Drain-Source On Resistance Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Feedback Capacitance (Crss) Reference Standard

PMBS3906T/R

NXP Semiconductors

PNP

SINGLE

YES

150 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.4 V

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

100

150 Cel

4.5 pF

SILICON

40 V

100 ns

700 ns

MATTE TIN

DUAL

R-PDSO-G3

Not Qualified

TO-236AB

e3

260

PUMB20-125

NXP Semiconductors

PNP

YES

.3 W

.1 A

2

BIP General Purpose Small Signal

30

SILICON

PEMB20,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PBLS4001V

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.5 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

200

150 Cel

SILICON

40 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PBLS4003Y,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMB24

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.02 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PBLS1504V,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

60

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMB4,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

200

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR

e3

30

260

PUMB11,135

NXP Semiconductors

PNP

YES

.3 W

.1 A

2

BIP General Purpose Small Signal

30

SILICON

TIN

1

e3

30

260

PEMB11

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PBLS1503V,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PBLS1502Y,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMB18

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

50

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 2.1

e3

30

260

BCV72T/R

NXP Semiconductors

NPN

SINGLE

YES

100 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.25 V

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

200

150 Cel

SILICON

60 V

MATTE TIN

DUAL

R-PDSO-G3

Not Qualified

TO-236AB

e3

260

PEMB10,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 21

e3

30

260

PBLS4005Y,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMB30

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

AMPLIFIER

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR

e3

30

260

PEMB24,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.02 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PMEM1505PG,115

NXP Semiconductors

PNP

SINGLE WITH BUILT-IN DIODE

YES

280 MHz

.3 W

.5 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

1

5

SMALL OUTLINE

Other Transistors

90

SILICON

15 V

MATTE TIN

DUAL

R-PDSO-G5

Not Qualified

e3

PBLS4002V,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

BCW29,235

NXP Semiconductors

PNP

SINGLE

YES

100 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.3 V

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

120

150 Cel

SILICON

32 V

TIN

DUAL

R-PDSO-G3

1

Not Qualified

TO-236AB

e3

30

260

PBLS1502V,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMB19,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

e3

30

260

PEMB14,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR

e3

30

260

PEMB13,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

PEMB15,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PBLS4005V

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

80

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PBLS4001V,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.5 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

200

150 Cel

SILICON

40 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PIMT1,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS

YES

100 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

120

150 Cel

SILICON

40 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

e3

30

260

PUMB19,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

e3

30

260

PUMB9

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

30

260

PUMB11

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

BC860C

NXP Semiconductors

PNP

SINGLE

YES

100 MHz

.3 W

.1 A

PLASTIC/EPOXY

AMPLIFIER

.65 V

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

420

150 Cel

SILICON

45 V

Tin (Sn)

DUAL

R-PDSO-G3

1

Not Qualified

LOW NOISE

TO-236AB

e3

30

260

PBLS1501Y/T2

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

PEMB30,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

AMPLIFIER

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR

e3

30

260

PBLS4001Y

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.5 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

200

150 Cel

SILICON

40 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PBLS1504Y,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

60

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMT1,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS

YES

100 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

120

150 Cel

SILICON

40 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

e3

30

260

PBLS4004D/T1

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

60

150 Cel

SILICON

40 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

e3

BF570,215

NXP Semiconductors

NPN

SINGLE

YES

490 MHz

.3 W

.1 A

PLASTIC/EPOXY

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

40

150 Cel

SILICON

15 V

TIN

DUAL

R-PDSO-G3

1

Not Qualified

e3

30

260

PBLS1504Y

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

60

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PBLS1503Y,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMB18,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

50

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 2.1

e3

30

260

PBLS4003V,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

300 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PIMZ2,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS

YES

100 MHz

.3 W

.15 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

120

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

e3

30

260

PUMB20-135

NXP Semiconductors

PNP

YES

.3 W

.1 A

2

BIP General Purpose Small Signal

30

SILICON

PEMF21

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

280 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMX1

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS

YES

100 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

Other Transistors

120

150 Cel

SILICON

40 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

e3

30

260

Small Signal Bipolar Junction Transistors (BJT)

Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.

Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.

The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.

Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395