230 MHz Small Signal Bipolar Junction Transistors (BJT) 419

Reset All
Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Minimum DS Breakdown Voltage Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Turn Off Time (toff) Terminal Finish Maximum Drain-Source On Resistance Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Feedback Capacitance (Crss) Reference Standard

PQMD13

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

100

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 10

e3

30

260

AEC-Q101; IEC-60134

PQMD12

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

80

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

934065949315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

60

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 0.47

AEC-Q101; IEC-60134

934065881315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 10

AEC-Q101; IEC-60134

934065944315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

40

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 0.21

AEC-Q101; IEC-60134

PQMH9

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

100

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 4.7

e3

30

260

AEC-Q101; IEC-60134

934065953315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.02 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

80

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

AEC-Q101; IEC-60134

934065951315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

200

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTOR

AEC-Q101; IEC-60134

PQMH11

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

934065879315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

50

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 2.1

AEC-Q101; IEC-60134

934056861115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

AEC-Q101

PQMD10

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

100

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 21

e3

30

260

AEC-Q101; IEC-60134

PQMH2

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

80

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

934066527315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTOR

AEC-Q101; IEC-60134

934065882315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 21

AEC-Q101; IEC-60134

934056861315

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

DUAL

R-PDSO-F6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101

934056606215

NXP Semiconductors

NPN

SINGLE

YES

230 MHz

2 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

150

SILICON

40 V

TIN

DUAL

R-PDSO-G3

1

Not Qualified

TO-236AB

e3

934067008315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

30

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

AEC-Q101; IEC-60134

934065954315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

200

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTOR

AEC-Q101; IEC-60134

934065945315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTOR

AEC-Q101; IEC-60134

934069147147

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

C BEND

RECTANGULAR

1

3

SMALL OUTLINE

100

SILICON

50 V

DUAL

R-PDSO-C3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 4.7

NOT SPECIFIED

NOT SPECIFIED

AEC-Q101; IEC-60134

934065943315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

80

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

AEC-Q101; IEC-60134

934065939315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

30

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

AEC-Q101; IEC-60134

PQMD2

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

60

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

934065948315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

30

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

AEC-Q101; IEC-60134

934057986215

NXP Semiconductors

NPN

SINGLE

YES

230 MHz

2 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

150

SILICON

30 V

DUAL

R-PDSO-G3

TO-236AB

PQMD16

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

2

6

SMALL OUTLINE

80

SILICON

50 V

TIN

DUAL

R-PDSO-N6

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 2.13

e3

30

260

AEC-Q101; IEC-60134

934063196215

NXP Semiconductors

NPN

SINGLE

YES

230 MHz

2 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

150

SILICON

40 V

DUAL

R-PDSO-G3

TO-236AB

934065946315

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

30

SILICON

50 V

BOTTOM

R-PBCC-N3

COLLECTOR

BUILT IN BIAS RESISTOR

AEC-Q101; IEC-60134

934049930135

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101

PUMH11/T1

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101

PDTC123JMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 21

e3

AEC-Q101; IEC-60134

PUMH11,165

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101

PDTC115EMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.02 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

80

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

AEC-Q101; IEC-60134

PDTC143EMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

30

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

AEC-Q101; IEC-60134

PDTC124EMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

60

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

AEC-Q101; IEC-60134

PDTC144ETT/R

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

.3 V

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

80

150 Cel

3.5 pF

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G3

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

TO-236AB

e3

40

260

PDTC144ET-T

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

.3 V

GULL WING

RECTANGULAR

1

3

SMALL OUTLINE

80

150 Cel

3.5 pF

SILICON

50 V

TIN

DUAL

R-PDSO-G3

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

TO-236AB

e3

PDTC124TMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTOR

e3

AEC-Q101; IEC-60134

PDTC144TMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTOR

e3

AEC-Q101; IEC-60134

PDTC114TMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

200

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTOR

e3

AEC-Q101; IEC-60134

PDTC144EMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

80

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

AEC-Q101; IEC-60134

PDTC144EQA

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

SMALL OUTLINE

80

SILICON

50 V

TIN

DUAL

R-PDSO-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

PDTC124XMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

80

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 2.1

e3

AEC-Q101; IEC-60134

PDTC114EMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

30

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

AEC-Q101; IEC-60134

PUMH11,135

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101

PBSS4240Y

NXP Semiconductors

NPN

SINGLE

YES

230 MHz

.27 W

2 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

1

6

SMALL OUTLINE

Other Transistors

150

150 Cel

SILICON

40 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

e3

30

260

PDTC115TMB

NXP Semiconductors

NPN

SINGLE WITH BUILT-IN RESISTOR

YES

230 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

NO LEAD

RECTANGULAR

1

3

CHIP CARRIER

100

SILICON

50 V

TIN

BOTTOM

R-PBCC-N3

1

COLLECTOR

BUILT IN BIAS RESISTOR

e3

AEC-Q101; IEC-60134

Small Signal Bipolar Junction Transistors (BJT)

Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.

Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.

The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.

Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395