Micron Technology MU
8000 S. Federal Way, Boise, Idaho 83716-9632
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Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
Fiscal Year
31-Aug-23
Total employees
43,000
Micron holds over 10,800 patents worldwide including more than 4500 US patents related to various aspects of semiconductor device technology. The company’s commitment to investing heavily in research & development keeps it at the cutting edge of technological innovation in this fast evolving industry. Micron's DRAM products include LPDRAM, DDR4/DDR3 SDRAM for servers, PCs and notebooks; GDDR6/GDDR5 SGRAM for graphics boards; RL DRAM (LPDRAM) for low-power applications like IoT sensors and connected devices. Its Flash products include 3D NAND SSDs for data center applications such as cloud storage and Big Data analytics, iNAND Embedded Flash Drives (EFDs) for mobile phones and tablets, SD cards for consumer electronics devices as well as SATA SSDs for laptop PCs. In addition to its traditional semiconductor business, Micron also offers advanced services such as component fabrication services (Fab Services), design & manufacturing services (DMS) that provide customers with end-to-end product solutions from concept to delivery.
Part categories
Amplifiers 15
Interface ICs 3
Logic ICs 14
Memory ICs 77,481
Miscellaneous Components 11,115
Optoelectronics 2
Other Function Semiconductors 17
Peripheral ICs 420
Sensors & Transducers 114
Transformers 1
Triggering Devices 1
Leadership
Revenue Overview
| Year | Revenue | Gross Margin | Gross Margin % | Net Income |
|---|---|---|---|---|
|
2020 |
Revenue $21,435M |
Gross Margin $6,552M |
Gross Margin % 31% |
Net Income $2,710M |
|
2021 |
Revenue $27,705M |
Gross Margin $10,423M |
Gross Margin % 38% |
Net Income $5,861M |
|
2022 |
Revenue $30,758M |
Gross Margin $13,898M |
Gross Margin % 45% |
Net Income $8,687M |
|
2023 |
Revenue $15,540M |
Gross Margin $-1,416M |
Gross Margin % -9% |
Net Income $-5,833M |
Product Segment Overview
| Year | Compute and Networking Business Unit (CNBU) | CNBU % of Revenue | Mobile Business Unit (MBU) | MBU % of Revenue | Embedded Business Unit (EBU) | EBU % of Revenue | Storage Business Unit (SBU) | SBU % of Revenue | All Other | Total Revenue |
|---|---|---|---|---|---|---|---|---|---|---|
|
2020 |
Compute and Networking Business Unit (CNBU) $9,184M |
CNBU % of Revenue 43% |
Mobile Business Unit (MBU) $5,702M |
MBU % of Revenue 27% |
Embedded Business Unit (EBU) $2,759M |
EBU % of Revenue 13% |
Storage Business Unit (SBU) $3,765M |
SBU % of Revenue 18% |
All Other $25M |
Total Revenue $21,435M |
|
2021 |
Compute and Networking Business Unit (CNBU) $12,280M |
CNBU % of Revenue 44% |
Mobile Business Unit (MBU) $7,203M |
MBU % of Revenue 26% |
Embedded Business Unit (EBU) $4,209M |
EBU % of Revenue 15% |
Storage Business Unit (SBU) $3,973M |
SBU % of Revenue 14% |
All Other $40M |
Total Revenue $27,705M |
|
2022 |
Compute and Networking Business Unit (CNBU) $13,693M |
CNBU % of Revenue 45% |
Mobile Business Unit (MBU) $7,260M |
MBU % of Revenue 24% |
Embedded Business Unit (EBU) $5,235M |
EBU % of Revenue 17% |
Storage Business Unit (SBU) $4,553M |
SBU % of Revenue 15% |
All Other $17M |
Total Revenue $30,758M |
|
2023 |
Compute and Networking Business Unit (CNBU) $5,710M |
CNBU % of Revenue 37% |
Mobile Business Unit (MBU) $3,630M |
MBU % of Revenue 23% |
Embedded Business Unit (EBU) $3,637M |
EBU % of Revenue 23% |
Storage Business Unit (SBU) $2,553M |
SBU % of Revenue 16% |
All Other $10M |
Total Revenue $15,540M |
End Markets Overview
| Year | Automotive, Industrial, and Consumer |
|---|---|
|
2020 |
Automotive, Industrial, and Consumer 15% |
|
2021 |
Automotive, Industrial, and Consumer 15% |
|
2022 |
Automotive, Industrial, and Consumer 15% |
|
2023 |
Automotive, Industrial, and Consumer 25% |
Geographic Overview
| Year | United States | Taiwan | China | Japan | Hong Kong | Other Asia Pacific | Other | Total Revenue |
|---|---|---|---|---|---|---|---|---|
|
2020 |
United States $10,381M |
Taiwan $3,657M |
China $2,337M |
Japan $1,387M |
Hong Kong $1,792M |
Other Asia Pacific $1,157M |
Other $724M |
Total Revenue $21,435M |
|
2021 |
United States $12,155M |
Taiwan $6,606M |
China $2,456M |
Japan $1,652M |
Hong Kong $2,582M |
Other Asia Pacific $1,420M |
Other $834M |
Total Revenue $27,705M |
|
2022 |
United States $16,026M |
Taiwan $6,185M |
China $3,311M |
Japan $1,696M |
Hong Kong $1,665M |
Other Asia Pacific $1,223M |
Other $652M |
Total Revenue $30,758M |
|
2023 |
United States $7,805M |
Taiwan $2,697M |
China $2,181M |
Japan $987M |
Hong Kong $340M |
Other Asia Pacific $752M |
Other $778M |
Total Revenue $15,540M |
Properties
Micron Technology
| City | State | Country |
|---|---|---|
|
City Taichung |
State - |
Country Taiwan |
|
City Taoyuan |
State - |
Country Taiwan |
|
City Singapore |
State - |
Country Singapore |
|
City Hiroshima |
State - |
Country Japan |
|
City Boise |
State Idaho |
Country USA |
|
City Manassas |
State Virginia |
Country USA |
|
City Maur |
State - |
Country Malaysia |
|
City Penang |
State - |
Country Malaysia |
|
City Xi'an |
State - |
Country China |
Fab locations
Micron Technology
| City | State | Country | FAB facility name | Fab initiation | Wafer capacity |
|---|---|---|---|---|---|
|
City Boise |
State Boise |
Country Boise |
FAB facility name Fab 4 |
Fab initiation 1994 |
Wafer capacity 8750 |
|
City Manassas |
State Manassas |
Country Manassas |
FAB facility name Fab 6 |
Fab initiation 1997 |
Wafer capacity 23000 |
|
City Manassas |
State Manassas |
Country Manassas |
FAB facility name Fab 6 |
Fab initiation 2006 |
Wafer capacity 28000 |
|
City Taoyuan |
State Taoyuan |
Country Taoyuan |
FAB facility name Fab 11 |
Fab initiation 2007 |
Wafer capacity 34000 |
|
City Taichung |
State Taichung |
Country Taichung |
FAB facility name Fab 16 A1 |
Fab initiation 2007 |
Wafer capacity 50000 |
|
City Taichung |
State Taichung |
Country Taichung |
FAB facility name Fab 16 A3 |
Fab initiation 2021 |
Wafer capacity 3000 |
|
City Hiroshima |
State Hiroshima |
Country Hiroshima |
FAB facility name Fab 15 |
Fab initiation 2002 |
Wafer capacity 98000 |
|
City Taoyuan |
State Taoyuan |
Country Taoyuan |
FAB facility name Fab 11 |
Fab initiation 2004 |
Wafer capacity 34000 |
|
City Hiroshima |
State Hiroshima |
Country Hiroshima |
FAB facility name New Hiroshima DRAM Fab |
Fab initiation - |
Wafer capacity - |
|
City Boise |
State Boise |
Country Boise |
FAB facility name Fab 4 |
Fab initiation 2017 |
Wafer capacity 11750 |
|
City Singapore |
State Singapore |
Country Singapore |
FAB facility name Fab 10W |
Fab initiation 2016 |
Wafer capacity 20000 |
|
City Singapore |
State Singapore |
Country Singapore |
FAB facility name Fab 10X |
Fab initiation 2016 |
Wafer capacity 55000 |
|
City Hiroshima |
State Hiroshima |
Country Hiroshima |
FAB facility name Fab 15 |
Fab initiation 2019 |
Wafer capacity 18000 |
|
City Singapore |
State Singapore |
Country Singapore |
FAB facility name Fab 10A |
Fab initiation 2019 |
Wafer capacity 18000 |
|
City Singapore |
State Singapore |
Country Singapore |
FAB facility name Fab 10N |
Fab initiation 2014 |
Wafer capacity 47000 |
|
City Taoyuan |
State Taoyuan |
Country Taoyuan |
FAB facility name Fab 11 |
Fab initiation 2000 |
Wafer capacity 32000 |
|
City Boise |
State Boise |
Country Boise |
FAB facility name Fab 4 |
Fab initiation 2012 |
Wafer capacity 6000 |
|
City Taichung |
State Taichung |
Country Taichung |
FAB facility name Fab 16 A2 |
Fab initiation 2015 |
Wafer capacity 43000 |
|
City Clay |
State Clay |
Country Clay |
FAB facility name New Clay Fab Phase 1 |
Fab initiation 2027 |
Wafer capacity - |
|
City Boise |
State Boise |
Country Boise |
FAB facility name New Boise Fab 1 |
Fab initiation 2025 |
Wafer capacity - |
|
City Hiroshima |
State Hiroshima |
Country Hiroshima |
FAB facility name Fab 15 |
Fab initiation 2021 |
Wafer capacity - |
|
City Taichung |
State Taichung |
Country Taichung |
FAB facility name Fab 16 A5 |
Fab initiation 2028 |
Wafer capacity - |
|
City Manassas |
State Manassas |
Country Manassas |
FAB facility name Expansion Fab |
Fab initiation 2020 |
Wafer capacity 6000 |