3m Electronic Products Division - 2625-6325-9UA-1902

  1. Home
  2. 3m Electronic Products Division - 2625-6325-9UA-1902
2625-6325-9UA-1902 by 3m Electronic Products Division

Image shown is a representation only.

Manufacturer 3m Electronic Products Division
Manufacturer's Part Number 2625-6325-9UA-1902
Description IC SOCKET; Device Type Used On: PGA625; Housing Material: POLYETHERSULFONE; JESD-609 Code: e4; No. of Contacts: 625; Additional Features: 3M; TEXTOOL;
Datasheet 2625-6325-9UA-1902 Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold (30) over Nickel (50)
IC Socket Type: IC Socket
Contact Finish (Termination): Gold (30) over Nickel (50)
Housing Material: Polyethersulfone (PES)
Device Type Used On: PGA625
Additional Features: 3M; Textool
JESD-609 Code: e4
No. of Contacts: 625
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

8452-21B1-RK-TP by 3m Electronic Products Division

8452-21B1-RK-TP

3m Electronic Products Division

8452-21B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with a housing made of glass-filled polyphenylene sulfide. It is used on PLCC52 devices and has a surface mount termination type. With 52 contacts and insulation resistance of 1G ohm, it operates in temperatures ranging from -40 to 105 °C.
5-1415043-1 by TE Connectivity

5-1415043-1

TE Connectivity

IC SOCKET; No. of Contacts: 2; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
PY08-Y3 by Omron

PY08-Y3

Omron

RELAY SOCKET;
SS-104-G-22-N by Samtec

SS-104-G-22-N

Samtec

SS-104-G-22-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. This socket is used on SIP4 devices and operates b/w -65°C to 125°C, making it ideal for various electronic applications.
173-10-328-00-001000 by Mill-max Mfg

173-10-328-00-001000

Mill-max Mfg

The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
2-1393143-2 by TE Connectivity

2-1393143-2

TE Connectivity

IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
SS5-20-3.50-L-D-K-TR by Samtec

SS5-20-3.50-L-D-K-TR

Samtec

IC SOCKET;
8134-HC-5P2 by TE Connectivity

8134-HC-5P2

TE Connectivity

TE Connectivity's 8134-HC-5P2 chip carrier socket features PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. With a wide temperature range (-65 to 125°C), it is ideal for IC applications requiring high insulation resistance (1G ohm) in straight mounting setups.
2-345832-2 by Tyco Electronics Amp

2-345832-2

Tyco Electronics Amp

IC SOCKET; Device Type Used On: DIP20; Manufacturer Series: 345832; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0;
XR2A-2025 by Omron

XR2A-2025

Omron

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-2461-N by Omron

XR2A-2461-N

Omron

IC SOCKET; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER;
60431011 by Delphi Connection Systems

60431011

Delphi Connection Systems

RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
350-10-117-00-001000 by Mill-max Mfg

350-10-117-00-001000

Mill-max Mfg

350-10-117-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP17 devices with 17 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
390262-5 by Tyco Electronics Amp

390262-5

Tyco Electronics Amp

390262-5 by Tyco Electronics Amp is a DIP40 IC socket with GLASS FILLED POLYBUTYLENE TEREPHTHALATE housing and PHOSPHOR BRONZE contacts. It features 40 contacts with TIN LEAD finish for mating and termination. Ideal for use in Chip Carrier IC applications.
228-1290-09-0602J by 3m Electronic Products Division

228-1290-09-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 228-1290-09-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier applications requiring secure component sockets.
M12883/44-01 by Defense Logistics Agency

M12883/44-01

Defense Logistics Agency

RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
173-10-322-00-001000 by Mill-max Mfg

173-10-322-00-001000

Mill-max Mfg

173-10-322-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP22 devices with 22 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is used in Chip Carrier IC & Component Sockets applications.
PR3-BSC1/3X21 by Phoenix Contact

PR3-BSC1/3X21

Phoenix Contact

RELAY SOCKET; Device Type Used On: RELAY; Rating (Current): 10 A; Maximum Operating Temperature: 85 Cel; Body Length: 2.95 inch; Body Width: 1.496 inch;
XR2B-2811-N by Omron

XR2B-2811-N

Omron

IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
8134-HC-6P2 by TE Connectivity

8134-HC-6P2

TE Connectivity

TE Connectivity's 8134-HC-6P2 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. Ideal for applications requiring a temperature range of -65°C to 125°C, this socket offers reliable performance in various electronic devices.