Advanced Micro Devices - AM27S29APCB

AM27S29APCB by Advanced Micro Devices

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Manufacturer Advanced Micro Devices
Manufacturer's Part Number AM27S29APCB
Description OTP ROM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
Datasheet AM27S29APCB Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512X8
Output Characteristics: 3-STATE
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.75 V
Sub-Category: OTP ROMs
Surface Mount: NO
Maximum Supply Current: 160 mA
Terminal Finish: TIN LEAD
No. of Terminals: 20
No. of Words: 512 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T20
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Width: 7.62 mm
Memory Density: 4096 bit
Memory IC Type: OTP ROM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP20,.3
Length: 26.035 mm
Maximum Access Time: 35 ns
No. of Words Code: 512
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
Maximum Supply Voltage (Vsup): 5.25 V
Power Supplies (V): 5
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