Image shown is a representation only.
| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | AD8311ACBZ-P7 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | AD8311ACBZ-P7 Datasheet |
| In Stock | 242 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .675 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .0129 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 6 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-XBGA-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | .95 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA6,2X3,20 |
| Length: | 1.45 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
