Image shown is a representation only.
| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | ADG3308BCBZ-1-RL7 |
| Description | INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 20; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | ADG3308BCBZ-1-RL7 Datasheet |
| In Stock | 868 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.15 V |
| Package Body Material: | PLASTIC/EPOXY |
| Minimum Supply Voltage-1: | 1.65 V |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Seated Height: | .65 mm |
| Sub-Category: | Other Interface ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 20 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B20 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Interface IC Type: | INTERFACE CIRCUIT |
| Width: | 2 mm |
| Maximum Supply Voltage-1: | 5.5 V |
| Moisture Sensitivity Level (MSL): | 1 |
| Maximum Supply Voltage: | 5.5 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA20,4X5,20 |
| Length: | 2.5 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.2/5,1.8/5 |
