Analog Devices - ADSP-21489KCPZ-4

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

XAM6254ATCGGAALW by Texas Instruments is a microprocessor with integrated cache and a 64-bit size. It has a max clock frequency of 26 MHz and is suitable for applications requiring low power mode, such as embedded systems or IoT devices.

The Texas Instruments AM5728BABCXEA microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for industrial applications requiring high-speed processing in a compact package with low power mode capability.

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE;

TDA4VM88TGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for industrial applications requiring high-speed processing. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various embedded systems.

ATSAMA5D27C-LD1G-CU by Microchip features 16-bit architecture, 24 MHz clock frequency, and 32KB RAM. Ideal for industrial applications requiring low power consumption and high-speed processing.

STM32MP135DAE7 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz max clock frequency. Ideal for low power applications, it features 56 DMA channels and operates b/w -40 to 105 °C.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

The NXP Semiconductors MPC880CZP133 is a 32-bit microprocessor with integrated cache and low power mode. It operates at a speed of 133 rpm, with a max supply voltage of 1.9 V. Ideal for applications requiring high performance in compact devices.

The Intel LH8066803102701SREKA microprocessor features 64-bit size, 1296 terminals, and operates at speeds up to 1800 rpm. It is designed for applications requiring high processing power in a compact form factor, such as servers, workstations, and high-performance computing systems.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);

ATSAMA5D22C-CNR by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. The package style is grid array, thin profile, fine pitch with terminal finish of tin silver copper nickel.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

NXP Semiconductors' MPC8270VRMIBA microprocessor features 32-bit address and external data bus width, with a max clock frequency of 266 MHz. Ideal for commercial applications, it has integrated cache memory and operates at temperatures ranging from 0 to 70 °C.

FA80386EXTC33 by Rochester Electronics is a 32-bit microprocessor with 26-bit address bus width, operating at a max clock frequency of 66 MHz. It features low power mode and boundary scan capabilities, suitable for industrial applications requiring high-speed processing in compact spaces. The package style is flatpack with a low profile and fine pitch design, making it ideal for surface mount installations.