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Manufacturer | Analog Devices |
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Manufacturer's Part Number | ADSP-SC573-BCZENG |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | ADSP-SC573-BCZENG Datasheet |
In Stock | 867 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3.13 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3.3 V |
Maximum Supply Voltage: | 3.47 V |
Maximum Seated Height: | 1.5 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 400 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Length: | 17 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B400 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | LFBGA |
Width: | 17 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL |