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Manufacturer | Analog Devices |
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Manufacturer's Part Number | DS2401X-S+T |
Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; |
In Stock | 635 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 64X1 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .5 mm |
Minimum Supply Voltage (Vsup): | 2.8 V |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER NICKEL |
No. of Terminals: | 4 |
No. of Words: | 64 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B4 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | .678 mm |
Moisture Sensitivity Level (MSL): | 1 |
Memory Density: | 64 bit |
Memory IC Type: | MEMORY CIRCUIT |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 1 |
No. of Functions: | 1 |
Package Equivalence Code: | BGA4,2X2,28/12 |
Length: | 1.338 mm |
No. of Words Code: | 64 |
Nominal Supply Voltage / Vsup (V): | 5 |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .3 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 6 V |