Image shown is a representation only.
| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | HMC6301BG46 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 75; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | HMC6301BG46 Datasheet |
| In Stock | 864 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
1127-3360 HMC6301BG35 -2735-HMC6301BG46 1127-3360-ND 1127-3279 |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.35 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .815 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 75 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 6 mm |
| JESD-30 Code: | R-PBGA-B75 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | VFBGA |
| Width: | 4 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |









