
Image shown is a representation only.
Manufacturer | Analog Devices |
---|---|
Manufacturer's Part Number | HMC6301BG46 |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 75; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | HMC6301BG46 Datasheet |
In Stock | 864 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.35 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | .815 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 75 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Length: | 6 mm |
JESD-30 Code: | R-PBGA-B75 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | VFBGA |
Width: | 4 mm |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Moisture Sensitivity Level (MSL): | 1 |