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Manufacturer | Analog Devices |
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Manufacturer's Part Number | HMC859LC3 |
Description | LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE; |
Datasheet | HMC859LC3 Datasheet |
In Stock | 921 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
Maximum Seated Height: | 1.31 mm |
Surface Mount: | YES |
Logic IC Type: | LOGIC CIRCUIT |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 16 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG |
Length: | 3 mm |
JESD-30 Code: | S-CQCC-N16 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Family: | 859 |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | HQCCN |
Width: | 3 mm |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Moisture Sensitivity Level (MSL): | 3 |