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| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | MAX14670EWL+ |
| Description | Power Management Circuits; Temperature Grade: INDUSTRIAL; No. of Terminals: 15; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| In Stock | 959 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Power Management Circuits |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER NICKEL |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 15 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA15,3X5,16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | BICMOS |
| JESD-30 Code: | R-PBGA-B15 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | FBGA |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/28 |
| Moisture Sensitivity Level (MSL): | 1 |
