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| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | MAX19692EXW+D |
| Description | D/A CONVERTER; Terminal Form: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE; Width: 11 mm; |
| In Stock | 1,461 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Plastic/Epoxy |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Seated Height: | 0.059 in (1.5 mm) |
| Maximum Supply Current: | 117 mA |
| Surface Mount: | Yes |
| Nominal Settling Time (tstl): | 4.5 ns |
| No. of Terminals: | 169 |
| Terminal Position: | Bottom |
| Package Style (Meter): | Grid Array, Low Profile, Fine Pitch |
| Technology: | BICMOS |
| JESD-30 Code: | S-PBGA-B169 |
| Package Shape: | Square |
| Terminal Form: | Ball |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | LFBGA |
| Width: | 0.433 in (11 mm) |
| No. of Bits: | 12 |
| Input Format: | Parallel, Word |
| Converter Type: | Digital to Analog converter |
| Minimum Operating Temperature: | -40 °C (-40 °F) |
| Maximum Linearity Error (EL): | 0.031738 % |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA169,13X13,32 |
| Length: | 0.433 in (11 mm) |
| Input Bit Code: | Offset Binary |
| Peak Reflow Temperature (C): | 260 °C (500 °F) |
| Terminal Pitch: | 0.031 in (0.8 mm) |
