Analog Devices - MAX2674EWT+T

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MAX2674EWT+T by Analog Devices

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Manufacturer Analog Devices
Manufacturer's Part Number MAX2674EWT+T
Description RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;
In Stock1,427
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .69 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER NICKEL
No. of Terminals: 6
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: BICMOS
JESD-30 Code: R-PBGA-B6
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: .865 mm
Moisture Sensitivity Level (MSL): 1
Telecom IC Type: RF AND BASEBAND CIRCUIT
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 1.27 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
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