
Image shown is a representation only.
Manufacturer | Analog Devices |
---|---|
Manufacturer's Part Number | MAX3100ETG+ |
Description | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; |
In Stock | 1,719 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 2.7 V |
Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .8 mm |
Sub-Category: | Serial IO/Communication Controllers |
Surface Mount: | YES |
Terminal Finish: | Matte Tin (Sn) - annealed |
No. of Terminals: | 24 |
No. of Serial I/Os: | 1 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Address Bus Width: | 0 |
Maximum Data Transfer Rate: | .028125 MBps |
Technology: | BICMOS |
JESD-30 Code: | S-XQCC-N24 |
Maximum Clock Frequency: | 3.6864 MHz |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVQCCN |
Width: | 4 mm |
Moisture Sensitivity Level (MSL): | 1 |
Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Maximum Supply Voltage: | 5.5 V |
Low Power Mode: | YES |
Boundary Scan: | NO |
External Data Bus Width: | 0 |
Communication Protocol: | ASYNC, BIT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC24,.16SQ,20 |
Length: | 4 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3/5 |