PRIME X570-P by ASUS Computer International

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Manufacturer ASUS Computer International
Manufacturer's Part Number PRIME X570-P
Description Asus; Product Line: Prime; Product Model: X570-P; Product Type: Desktop Motherboard; HDMI: Yes; Number of USB 3.2 Gen 2 Type-A Ports: 4;
NAME DESCRIPTION
Chipset Manufacturer: AMD
Number of SATA Interfaces: 6
Processor Supported: Ryzen 7, Ryzen 7 PRO, Ryzen 5, Ryzen 5 Pro, Ryzen 3, Ryzen 9
Memory Speed Supported: 4400 MHz, 4266 MHz, 4133 MHz, 4000 MHz, 3866 MHz, 3733 MHz, 3600 MHz, 3466 MHz, 3400 MHz, 3000 MHz, 2933 MHz, 2800 MHz, 2666 MHz, 2400 MHz, 2133 MHz, 3200 MHz
Onboard S/PDIF Header: Yes
Number of M.2 Interfaces: 2
Chipset Model: X570
Controller Type: Serial ATA/600
Number of USB 2.0 Ports: 2
Maximum Memory Supported: 128 GB
Total Number of USB Ports: 8
Number of USB 3.2 Gen 1 Ports: 2
Depth: 9.6 "
RAID Supported: Yes
Form Factor: ATX
Memory Technology: DDR4 SDRAM
Onboard Video: CPU Dependent Video
Package Contents:
  • Prime X570-P Desktop Motherboard
  • 2 x Serial ATA 6.0Gb/s Cables
  • 1 x Addressable RGB Header Extension Cable
  • 1 x IO Shield
  • 1 x M.2 Screw Package
  • 1 x User's Manual
  • 1 x Support DVD
    • Drivers
    • ASUS Utilities
    • EZ Update
Audio Channels: 7.1
Multi GPU Supported: CrossFireX
Total Number of Onboard USB Ports: 7
Number of Onboard USB 3.2 Ports: 4
Processor Socket: Socket AM4
Product Model: X570-P
RAID Levels: 0, 1, 10
Width: 12.0 "
Environmental Certification: RoHS
Number of Memory Slots: 4
Environmentally Friendly: Yes
Number of PCI Express x16 Slots: 2
Product Name: Prime X570-P Desktop Motherboard
Memory Form Factor: DIMM, UDIMM
Limited Warranty: 3 Year
Total Number of PCI Express Slots: 5
Brand Name: Asus
Number of PCI Express x1 Slots: 3
Number of USB 3.2 Gen 2 Type-A Ports: 4
Marketing Information:

Power Delivery Enhancements

Dr.MOS

Prime X570-Pro utilizes 12+2 power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that AMD’s latest processors demand.

6-Layer PCB Design

Improved thermal solution
6-layer PCB can quickly dissipate heat around the VRM, improving overall system stability and giving the cPU more overclocking headroom.
Compared with 4-layer PCB, temperature of 6-layer PCB will help decrease up to 30+ OC under default operation and 50+ OC under CPU OC mode, which can increase the PCB lifespan and reliability. 

Active Chipset Heatsink Solution

Dedicated cooling for unthrottled transfers

PCIe 4.0 provides twice the bandwidth for data flowing through the chipset, which creates more heat than the previous generation. The Prime X570-Pro features an actively cooled heatsink to prevent throttling during sustained transfers.

Active Chipset Heatsink Solution includes:

  • Air Duct: A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
  • Finned heatsink: The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
  • Custom Delta Superflo Fan: The custom low-noise fan features a high-durability bearing with a 60,000-hour L10 lifespan. 

PCIe 4.0 Ready on X570

Prime X570 Series equipped with PCIe 4.0 slots, PCIe 4.0 M.2 slots, 6-layer PCB deliver the best signal quality to enjoy the fastest data-transfer speeds on the 3rd Generation AMD Ryzen platform.

Addressable Gen 2 RGB header

Prime X570-P's Addressable Gen 2 RGB header is now capable of detecting the number of LEDs on second-gen addressable RGB devices, allowing the software to automatically tailor lighting effects to specific devices. The new headers also offer backward-compatibility with existing Aura RGB gear.
Total Processor Supported: 1
Product Type: Desktop Motherboard
Number of Total Expansion Slots: 5
HDMI: Yes
Country of Origin: China
Product Line: Prime
Gigabit Ethernet: Yes
Number of Onboard USB 2.0 Ports: 3