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Manufacturer | Broadcom |
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Manufacturer's Part Number | BCM1160 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: PIN/PEG; No. of Terminals: 276; Package Code: PGA; Package Shape: SQUARE; Surface Mount: NO; |
Datasheet | BCM1160 Datasheet |
In Stock | 410 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 2.5 V |
Surface Mount: | NO |
No. of Terminals: | 276 |
Qualification: | Not Qualified |
Terminal Position: | PERPENDICULAR |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-CPGA-P276 |
Package Shape: | SQUARE |
Terminal Form: | PIN/PEG |
Package Code: | PGA |
Moisture Sensitivity Level (MSL): | 1 |