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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | BCM1160 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: PIN/PEG; No. of Terminals: 276; Package Code: PGA; Package Shape: SQUARE; Surface Mount: NO; |
| Datasheet | BCM1160 Datasheet |
| In Stock | 410 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 2.5 V |
| Surface Mount: | NO |
| No. of Terminals: | 276 |
| Qualification: | Not Qualified |
| Terminal Position: | PERPENDICULAR |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-CPGA-P276 |
| Package Shape: | SQUARE |
| Terminal Form: | PIN/PEG |
| Package Code: | PGA |
| Moisture Sensitivity Level (MSL): | 1 |









