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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | BCM2724 |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 281; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; |
| Datasheet | BCM2724 Datasheet |
| In Stock | 340 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| No. of Functions: | 1 |
| No. of Terminals: | 281 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B281 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Package Code: | BGA |
