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Manufacturer | Broadcom |
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Manufacturer's Part Number | BCM4330SB2KUBG |
Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 133; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | BCM4330SB2KUBG Datasheet |
In Stock | 844 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.2 V |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | .55 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Minimum Operating Temperature: | -30 Cel |
No. of Functions: | 1 |
No. of Terminals: | 133 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA133,12X12,16 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Length: | 5.33 mm |
JESD-30 Code: | R-PBGA-B133 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Width: | 4.89 mm |
Terminal Pitch: | .4 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 3.6 |