BCM52311A1EH0H774S by Broadcom | Telecommunications

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Manufacturer	Broadcom
Manufacturer's Part Number	BCM52311A1EH0H774S
Description	TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet	BCM52311A1EH0H774S Datasheet
In Stock	95

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	.85 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	3.21 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	1152
Package Equivalence Code:	BGA1152,34X34,40
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, HEAT SINK/SLUG
Data Rate:	12500 Mbps
Length:	35 mm
JESD-30 Code:	S-PBGA-B1152
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	HBGA
Width:	35 mm
Terminal Pitch:	1 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
95	-	-

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