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Manufacturer | Broadcom |
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Manufacturer's Part Number | BCM52311A1HH0H325D |
Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1152; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
Datasheet | BCM52311A1HH0H325D Datasheet |
In Stock | 89 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .85 V |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 3.21 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
No. of Terminals: | 1152 |
Package Equivalence Code: | BGA1152,34X34,40 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Data Rate: | 27343.75 Mbps |
Length: | 35 mm |
JESD-30 Code: | S-PBGA-B1152 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | HBGA |
Width: | 35 mm |
Terminal Pitch: | 1 mm |