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Manufacturer | Broadcom |
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Manufacturer's Part Number | BCM53724 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
Datasheet | BCM53724 Datasheet |
In Stock | 258 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
No. of Terminals: | 1152 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B1152 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Surface Mount: | YES |