Broadcom - BCM5703S

BCM5703S by Broadcom

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Manufacturer	Broadcom
Manufacturer's Part Number	BCM5703S
Description	TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 300; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B300;
Datasheet	BCM5703S Datasheet
In Stock	367

BCM5703S Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Telecom IC Type:	TELECOM CIRCUIT
Surface Mount:	YES
No. of Functions:	1
No. of Terminals:	300
Qualification:	Not Qualified
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B300
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Package Code:	BGA
Moisture Sensitivity Level (MSL):	1

Pricing (USD)

Qty.	Unit Price	Ext. Price
367	-	-

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