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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | BCM5704C |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 300; Package Code: BGA; Terminal Position: BOTTOM; Peak Reflow Temperature (C): NOT SPECIFIED; |
| Datasheet | BCM5704C Datasheet |
| In Stock | 56 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| No. of Functions: | 1 |
| No. of Terminals: | 300 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | X-PBGA-B300 |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | BGA |
