Broadcom - BCM5705

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BCM5705 by Broadcom

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Manufacturer Broadcom
Manufacturer's Part Number BCM5705
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
Datasheet BCM5705 Datasheet
In Stock140
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Surface Mount: YES
No. of Terminals: 196
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B196
Package Shape: RECTANGULAR
Terminal Form: BALL
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: BGA
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