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Manufacturer | Broadcom |
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Manufacturer's Part Number | BCM5705M |
Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; JESD-30 Code: X-PBGA-B196; Surface Mount: YES; |
Datasheet | BCM5705M Datasheet |
In Stock | 210 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Telecom IC Type: | TELECOM CIRCUIT |
Surface Mount: | YES |
No. of Functions: | 1 |
No. of Terminals: | 196 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | X-PBGA-B196 |
Terminal Form: | BALL |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 1 |