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Manufacturer | Broadcom |
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Manufacturer's Part Number | BCM5788 |
Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Functions: 1; |
Datasheet | BCM5788 Datasheet |
In Stock | 418 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Telecom IC Type: | TELECOM CIRCUIT |
Surface Mount: | YES |
No. of Functions: | 1 |
No. of Terminals: | 196 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | X-PBGA-B196 |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Package Code: | BGA |