Broadcom - BCM5812KFB

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BCM5812KFB by Broadcom

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Manufacturer Broadcom
Manufacturer's Part Number BCM5812KFB
Description MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
Datasheet BCM5812KFB Datasheet
In Stock79
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Seated Height: 1.77 mm
Surface Mount: YES
No. of Terminals: 196
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B196
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.89 V
External Data Bus Width: 32
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA196,14X14,40
Length: 15 mm
Peak Reflow Temperature (C): 220
Bus Compatibility: PCI
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
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