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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | BCM5820KTB |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | BCM5820KTB Datasheet |
| In Stock | 219 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.375 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.5 V |
| Maximum Seated Height: | 1.75 mm |
| Surface Mount: | YES |
| No. of Terminals: | 256 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Maximum Clock Frequency: | 90 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 27 mm |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 2.625 V |
| External Data Bus Width: | 64 |
| Minimum Operating Temperature: | 0 Cel |
| Package Equivalence Code: | BGA256,20X20,50 |
| Length: | 27 mm |
| Bus Compatibility: | PCI |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |








