Broadcom - HSMP-389C-G

  1. Home
  2. Broadcom - HSMP-389C-G
HSMP-389C-G by Broadcom

Image shown is a representation only.

Manufacturer Broadcom
Manufacturer's Part Number HSMP-389C-G
Description PIN DIODE; Maximum Time At Peak Reflow Temperature (s): 20; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3;
Datasheet HSMP-389C-G Datasheet
In Stock1,238
NAME DESCRIPTION
Maximum Time At Peak Reflow Temperature (s): 20
Diode Type: PIN DIODE
Peak Reflow Temperature (C): 260
Terminal Finish: MATTE TIN
JESD-609 Code: e3
Moisture Sensitivity Level (MSL): 1
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,238 - -

Popular Products

Category Top Products

BXY43T1ESZZZA1 by Infineon Technologies

BXY43T1ESZZZA1

Infineon Technologies

PIN DIODE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
BAR88-02L by Infineon Technologies

BAR88-02L

Infineon Technologies

PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BA595E6327 by Infineon Technologies

BA595E6327

Infineon Technologies

Infineon's BA595E6327 is a PIN diode with 0.4 pF capacitance, 7 ohm forward resistance, and 50 V breakdown voltage. Ideal for attenuator and switching applications in medium to L band frequencies. Features small outline package, matte tin finish, and positive-intrinsic-negative technology.
BAR63-06W by Infineon Technologies

BAR63-06W

Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAP64-06T/R by NXP Semiconductors

BAP64-06T/R

NXP Semiconductors

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR6406WE6327HTSA1 by Infineon Technologies

BAR6406WE6327HTSA1

Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MA4P606-131 by M/a-com Burlington Semiconductor Operation

MA4P606-131

M/a-com Burlington Semiconductor Operation

PIN DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
1SV251-TB-E by Onsemi

1SV251-TB-E

Onsemi

1SV251-TB-E by Onsemi is a PIN diode with TIN BISMUTH finish. It can withstand 30s at 260 °C peak reflow temperature. Utilized in applications requiring POSITIVE-INTRINSIC-NEGATIVE technology for RF switching and attenuating signals.
BAR65-02V-E6433 by Infineon Technologies

BAR65-02V-E6433

Infineon Technologies

PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .5 pF; Nominal Minority Carrier Lifetime: .08 us; Maximum Diode Forward Resistance: .95 ohm; Diode Resistive Test Current: 5 mA;
RN771VTE-17 by ROHM

RN771VTE-17

ROHM

ROHM's RN771VTE-17 is a PIN diode with 35V reverse voltage, 150°C max temp, and 7 ohm forward resistance. Ideal for RF switches in applications requiring high-speed switching and low capacitance.
BAR15-1E6433 by Infineon Technologies

BAR15-1E6433

Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BXY43-T1H by Infineon Technologies

BXY43-T1H

Infineon Technologies

PIN DIODE; Terminal Position: UNSPECIFIED; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
APD0805-000 by Skyworks Solutions

APD0805-000

Skyworks Solutions

APD0805-000 by Skyworks Solutions is a single PIN diode for KA band applications. With a max diode capacitance of 0.05 pF, it operates at up to 175°C and has a forward resistance of 2 ohm. Ideal for attenuator and switching functions, this square-shaped chip is surface mountable with no lead terminals.
BAR64-06W by Infineon Technologies

BAR64-06W

Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1SV263 by Onsemi

1SV263

Onsemi

PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .23 pF; Minimum Breakdown Voltage: 50 V; Maximum Diode Forward Resistance: 2.5 ohm;
JDP3C02AU(TE85L,F) by Toshiba

JDP3C02AU(TE85L,F)

Toshiba

PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 100 MHz; Minimum Breakdown Voltage: 30 V; No. of Elements: 2; Reverse Test Voltage: 1 V;
BA895 by Infineon Technologies

BA895

Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
JDP2S01E(TPH3) by Toshiba

JDP2S01E(TPH3)

Toshiba

PIN DIODE;
BAR6402LRHE6327XTSA1 by Infineon Technologies

BAR6402LRHE6327XTSA1

Infineon Technologies

PIN DIODE;
1SV307(TPH3) by Toshiba

1SV307(TPH3)

Toshiba

PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 30 V; Maximum Operating Temperature: 125 Cel; Nominal Diode Capacitance: .5 pF; Maximum Diode Forward Resistance: 1.1 ohm;