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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | L-TMXL336251BL-3 |
| Description | ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | L-TMXL336251BL-3 Datasheet |
| In Stock | 416 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | ATM/SONET/SDH SUPPORT CIRCUIT |
| Maximum Seated Height: | 2.51 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 1152 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 45 mm |
| JESD-30 Code: | S-PBGA-B1152 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 245 |
| Package Code: | BGA |
| Width: | 45 mm |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
