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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | LG1605DXB-FLP |
| Description | ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LQFP; Package Shape: SQUARE; |
| Datasheet | LG1605DXB-FLP Datasheet |
| In Stock | 463 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, GLASS-SEALED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | ATM/SONET/SDH SUPPORT CIRCUIT |
| Maximum Seated Height: | 1.3716 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Qualification: | Not Qualified |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, LOW PROFILE |
| Length: | 5.842 mm |
| JESD-30 Code: | S-GQFP-G16 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 70 Cel |
| Peak Reflow Temperature (C): | 240 |
| Package Code: | LQFP |
| Width: | 5.842 mm |
| Terminal Pitch: | .762 mm |
| Temperature Grade: | COMMERCIAL |
