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Manufacturer | Broadcom |
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Manufacturer's Part Number | MTMXL846221BL-1 |
Description | ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 700; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | MTMXL846221BL-1 Datasheet |
In Stock | 371 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Telecom IC Type: | ATM/SONET/SDH SUPPORT CIRCUIT |
Maximum Seated Height: | 2.51 mm |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 700 |
Qualification: | Not Qualified |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 35 mm |
JESD-30 Code: | S-PBGA-B700 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 225 |
Package Code: | BGA |
Width: | 35 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |