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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | PEX8613-BA50BCG |
| Description | BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | PEX8613-BA50BCG Datasheet |
| In Stock | 916 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Maximum Seated Height: | 1.9 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 324 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B324 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HBGA |
| Width: | 19 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | BUS CONTROLLER, PCI |
| Drive Interface Standard: | IEEE 1149.1; IEEE 1149.6 |
| Maximum Supply Voltage: | 1.05 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Package Equivalence Code: | BGA324,18X18,40 |
| Length: | 19 mm |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | I2C; PCI; SMBUS; SPI; USB |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |









