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Manufacturer | Broadcom |
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Manufacturer's Part Number | PEX8624-BB50RBCF |
Description | BUS CONTROLLER, PCI; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | PEX8624-BB50RBCF Datasheet |
In Stock | 274 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Maximum Seated Height: | 2.48 mm |
Surface Mount: | YES |
No. of Terminals: | 324 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B324 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | HBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 4 |
Peripheral IC Type: | BUS CONTROLLER, PCI |
Maximum Supply Voltage: | 1.05 V |
External Data Bus Width: | 0 |
Minimum Operating Temperature: | 0 Cel |
Package Equivalence Code: | BGA324,18X18,40 |
Length: | 19 mm |
Peak Reflow Temperature (C): | 245 |
Bus Compatibility: | I2C; ISA; SMBUS; SPI; VGA |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |