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Manufacturer | Broadcom |
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Manufacturer's Part Number | T-8208---BAL2-DB |
Description | ATM/SONET/SDH NETWORK INTERFACE; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | T-8208---BAL2-DB Datasheet |
In Stock | 475 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2.54 mm |
Sub-Category: | ATM/SONET/SDH ICs |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 272 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B272 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 27 mm |
Telecom IC Type: | ATM/SONET/SDH NETWORK INTERFACE |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA272,20X20,50 |
Length: | 27 mm |
Peak Reflow Temperature (C): | 225 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |