Broadcom - TFRA08C13

TFRA08C13 by Broadcom

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Manufacturer	Broadcom
Manufacturer's Part Number	TFRA08C13
Description	FRAMER; Terminal Form: BALL; No. of Terminals: 352; Package Code: BGA; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet	TFRA08C13 Datasheet
In Stock	127

TFRA08C13 Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	FRAMER
Surface Mount:	YES
Terminal Finish:	TIN LEAD
JESD-609 Code:	e0
No. of Functions:	8
No. of Terminals:	352
Qualification:	Not Qualified
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	X-PBGA-B352
Package Shape:	UNSPECIFIED
Terminal Form:	BALL
Peak Reflow Temperature (C):	225
Package Code:	BGA

Pricing (USD)

Qty.	Unit Price	Ext. Price
127	-	-

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