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Manufacturer | Broadcom |
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Manufacturer's Part Number | TMXF281553BAL-3C-DB |
Description | Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | TMXF281553BAL-3C-DB Datasheet |
In Stock | 213 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 456 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA456,26X26,50 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B456 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |