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| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | TMXF281553BAL-C2-DB |
| Description | ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | TMXF281553BAL-C2-DB Datasheet |
| In Stock | 172 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.54 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 456 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | S-PBGA-B456 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Width: | 35 mm |
| Telecom IC Type: | ATM/SONET/SDH SUPPORT CIRCUIT |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA456,26X26,50 |
| Length: | 35 mm |
| Peak Reflow Temperature (C): | 225 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
