Broadcom - TSWC02622

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TSWC02622 by Broadcom

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Manufacturer Broadcom
Manufacturer's Part Number TSWC02622
Description ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE;
Datasheet TSWC02622 Datasheet
In Stock125
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: ATM/SONET/SDH SUPPORT CIRCUIT
Maximum Seated Height: 2.12 mm
Surface Mount: YES
Terminal Finish: TIN LEAD
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 208
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 17 mm
JESD-30 Code: S-PBGA-B208
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 225
Package Code: BGA
Width: 17 mm
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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