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| Manufacturer | Conexant Systems |
|---|---|
| Manufacturer's Part Number | CX20548-11Z |
| Description | MODEM; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | CX20548-11Z Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .9 mm |
| Sub-Category: | Modems |
| Surface Mount: | YES |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 16 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Data Rate: | .002 Mbps |
| JESD-30 Code: | S-XQCC-N16 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HVQCCN |
| Width: | 4 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | MODEM |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC16,.16SQ,25 |
| Length: | 4 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3.3 |
