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| Manufacturer | Cypress Semiconductor |
|---|---|
| Manufacturer's Part Number | BCM43570KFFBG |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 242; Package Code: TFBGA; Package Shape: SQUARE; |
| Datasheet | BCM43570KFFBG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 516-BCM43570KFFBG |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.05 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 242 |
| Package Equivalence Code: | BGA242,23X23,16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Data Rate: | 867 Mbps |
| Length: | 10 mm |
| JESD-30 Code: | S-PBGA-B242 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Additional Features: | Also has 1.2 V core supply |
| Maximum Operating Temperature: | 60 Cel |
| Package Code: | TFBGA |
| Width: | 10 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | COMMERCIAL |
