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| Manufacturer | Cypress Semiconductor |
|---|---|
| Manufacturer's Part Number | CYW15G0403DXB-BGI |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | CYW15G0403DXB-BGI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 1.745 mm |
| Sub-Category: | Network Interfaces |
| Surface Mount: | YES |
| Maximum Supply Current: | 1.32 mA |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 256 |
| No. of Transceivers: | 4 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Data Rate: | 1500 Mbps |
| Technology: | BICMOS |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HBGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA256,20X20,50 |
| Length: | 27 mm |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
