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Manufacturer | Cypress Semiconductor |
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Manufacturer's Part Number | FM25L16B-DG |
Description | FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; |
Datasheet | FM25L16B-DG Datasheet |
In Stock | 4,756 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .000006 Amp |
Organization: | 2KX8 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .8 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 3 mA |
Terminal Finish: | Pure Tin (Sn) |
No. of Terminals: | 8 |
Maximum Clock Frequency (fCLK): | 20 MHz |
No. of Words: | 2048 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Write Protection: | HARDWARE/SOFTWARE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-N8 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Endurance: | 10000000000000 Write/Erase Cycles |
Package Code: | HVSON |
Width: | 4 mm |
Moisture Sensitivity Level (MSL): | 3 |
Serial Bus Type: | SPI |
Memory Density: | 16384 bit |
Minimum Standby Voltage: | 2.7 V |
Memory IC Type: | FRAM |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | SOLCC8,.16,37 |
Length: | 4.5 mm |
No. of Words Code: | 2K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | 2kv ESD available |
Minimum Data Retention Time: | 10 |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .95 mm |
Maximum Supply Voltage (Vsup): | 3.6 V |
Power Supplies (V): | 3/3.3 |