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| Manufacturer | Dallas Semiconductor |
|---|---|
| Manufacturer's Part Number | DS2502X1 |
| Description | OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Code: FBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified; |
| Datasheet | DS2502X1 Datasheet |
| In Stock | 590 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 128X8 |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 2 |
| No. of Words: | 128 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | R-PBGA-B2 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Other Names: |
MAXMAXDS2502X1 2156-DS2502X1 |
| Input/Output Type: | COMMON |
| Memory Density: | 1024 bit |
| Memory IC Type: | OTP ROM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA2,1X2,37 |
| Maximum Access Time: | 15000 ns |
| No. of Words Code: | 128 |
| Terminal Pitch: | .95 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
