Device Engineering - DEI1167-TES-G

DEI1167-TES-G by Device Engineering

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Manufacturer Device Engineering
Manufacturer's Part Number DEI1167-TES-G
Description INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G24;
Datasheet DEI1167-TES-G Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.97 V
Package Body Material: PLASTIC/EPOXY
Minimum Supply Voltage-1: 4.5 V
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.1938 mm
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 24
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: BICMOS
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Package Code: TSSOP
Interface IC Type: INTERFACE CIRCUIT
Width: 4.3942 mm
Nominal Supply Voltage-1: 5 V
Maximum Supply Voltage-1: 5.5 V
Moisture Sensitivity Level (MSL): 1
Maximum Supply Voltage: 3.63 V
JESD-609 Code: e4
No. of Functions: 1
Length: 7.7978 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
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