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| Manufacturer | Everspin Technologies |
|---|---|
| Manufacturer's Part Number | MR10Q010CMB |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | MR10Q010CMB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 128KX8 |
| Maximum Seated Height: | 1.35 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Surface Mount: | YES |
| No. of Terminals: | 24 |
| No. of Words: | 131072 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LBGA |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 1048576 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Length: | 8 mm |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
